STPS16H100CFP View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS16H100CFP Datasheet PDF : 10 Pages
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STPS16H100C
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
DocID8734 Rev 3
5/10
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