STPS30L60CR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS30L60CR Datasheet PDF : 13 Pages
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STPS30L60C
Characteristics
Figure 10. Forward voltage drop versus
forward current
(maximum values, per diode)
IFM(A)
200
100
Typical values
Tj=150°C
Tj=25°C
10
Tj=125°C
VFM(V)
1
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab for D2PAK
Rth(j-a)(°C/W)
80
70
60
Epoxy printed circuit board
copper thickness = 35 µm
50
40
30
20
10
0
0
S(cm²)
5
10
15
20
25
30
35
40
Figure 12. Reverse safe operating area (tp < 1 µs, Tj < 150 °C)
40 IARM (A)
38
36
34
32
30
28
26
24
Operating area
22
20
Forbidden area
VARM (V)
60
65
70
75
80
85
90
Doc ID 6479 Rev 10
5/13
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