PIC16LF870-I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LF870-I/SO Datasheet PDF : 156 Pages
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28-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
PIC16F870/871
E
E1
p
D
B
2
n
1
h
45°
c
A
α
A2
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
28
Pitch
p
.050
28
1.27
Overall Height
A
.093
.099
.104
2.36
2.50
Molded Package Thickness
A2
.088
.091
.094
2.24
2.31
Standoff
A1
.004
.008
.012
0.10
0.20
Overall Width
E
.394
.407
.420
10.01
10.34
Molded Package Width
E1
.288
.295
.299
7.32
7.49
Overall Length
D
.695
.704
.712
17.65
17.87
Chamfer Distance
h
.010
.020
.029
0.25
0.50
Foot Length
L
.016
.033
.050
0.41
0.84
Foot Angle Top
φ
0
4
8
0
4
Lead Thickness
c
.009
.011
.013
0.23
0.28
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.014
.017
.020
0.36
0.42
α
0
12
15
0
12
β
0
12
15
0
12
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
MAX
2.64
2.39
0.30
10.67
7.59
18.08
0.74
1.27
8
0.33
0.51
15
15
© 1999 Microchip Technology Inc.
Preliminary
DS30569A-page 141
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