PIC16LF870-I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LF870-I/SO Datasheet PDF : 156 Pages
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PIC16F870/871
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
E
E1
#leads=n1
p
D1 D
2
1
B
n
CH x 45 °
α
A
c
β
φ
L
A1
A2
(F)
Units
INCHES
MILLIMETERS*
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
44
44
Pitch
p
.031
0.80
Pins per Side
n1
11
11
Overall Height
A
.039
.043
.047
1.00
1.10
Molded Package Thickness
A2
.037
.039
.041
0.95
1.00
Standoff
A1
.002
.004
.006
0.05
0.10
Foot Length
L
.018
.024
.030
0.45
0.60
Footprint (Reference)
(F)
.039
1.00
Foot Angle
φ
0
3.5
7
0
3.5
Overall Width
E
.463
.472
.482
11.75
12.00
Overall Length
D
.463
.472
.482
11.75
12.00
Molded Package Width
E1
.390
.394
.398
9.90
10.00
Molded Package Length
D1
.390
.394
.398
9.90
10.00
Lead Thickness
c
.004
.006
.008
0.09
0.15
Lead Width
B
.012
.015
.017
0.30
0.38
Pin 1 Corner Chamfer
CH
.025
.035
.045
0.64
0.89
Mold Draft Angle Top
α
5
10
15
5
10
Mold Draft Angle Bottom
β
5
10
15
5
10
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
MAX
1.20
1.05
0.15
0.75
7
12.25
12.25
10.10
10.10
0.20
0.44
1.14
15
15
© 1999 Microchip Technology Inc.
Preliminary
DS30569A-page 143
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