STE2002(2002) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

Manufacturer

STE2002
(Rev.:2002)

81 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER

STMicroelectronics 

Table 16. Pad Coordinates (continued)

NAME

PAD

X (µm)

Y(µm)

R11

311

-3571.5

-275.0

R10

312

-3571.5

-325.0

R9

313

-3571.5

-375.0

R8

314

-3571.5

-425.0

R7

315

-3571.5

-475.0

R6

316

-3571.5

-525.0

R5

317

-3571.5

-575.0

R4

318

-3571.5

-625.0

R3

319

-3571.5

-675.0

R2

320

-3571.5

-725.0

R1

321

-3571.5

-775.0

R0

322

-3571.5

-825.0

ICON

323

-3571.5

-875.0

Figure 53. Alignment marks coordinates

X

-3574.5

+3574.5

-2250

+1200

Y

-949.5

-949.5

+949.5

+949.5

MARKS

mark1

mark2

mark3

mark4

STE2002

Figure 54. Alignment marks dimensions

94 µm

39 µm

Table 17. Bumps

Bump

Number

Bumps on Single

Row Size

1-187

212-235

256-260

283-323

Bumps on Two

Rows Size

188-211

236-255

261-282

Pad Size

1-323

Pad Pitch

1-323

Spacing

between Bumps

1-323

Dimensions

30µm X 98 µm X 17.5

30µm X 87 µm X 17.5

43µm X 107µm

50µm

20µm

Table 18. Die Mechanical Dimensions

Die Size

2.07mm x 7.32mm

Wafers Thickness

500µm

49/51

Share Link: