Z8F041APJ020EG View Datasheet(PDF) - Zilog

Part Name

Description

Manufacturer

Z8F041APJ020EG

High-Performance 8-Bit Microcontrollers Z8 Encore! XP® F082A Series

Zilog 

Z8 Encore! XP® F082A Series

Product Specification

245

Packaging

Zilog’s Product Line of MCUs includes the Z8F011A, Z8F012A, Z8F021A, Z8F022A,

Z8F041A, Z8F042A, Z8F081A and Z8F082A devices, which are available in the follow-

ing packages:

• 8-pin Plastic Dual-Inline Package (PDIP)

• 8-Pin Quad Flat No-Lead Package (QFN)/MLF-S1

• 8-pin Small Outline Integrated Circuit Package (SOIC)

• 20-pin Small Outline Integrated Circuit Package (SOIC)

• 20-pin Small Shrink Outline Package (SSOP)

• 20-pin Plastic Dual-Inline Package (PDIP)

• 28-pin Small Outline Integrated Circuit Package (SOIC)

• 28-pin Small Shrink Outline Package (SSOP)

• 28-pin Plastic Dual-Inline Package (PDIP)

Current diagrams for each of these packages are published in Zilog’s Packaging Product

Specification (PS0072), which is available free for download from the Zilog website.

1. The footprint of the QFN)/MLF-S package is identical to that of the 8-pin SOIC package, but with a lower profile.

PS022827-1212

PRELIMINARY

Packaging

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