AD5370BSTZ-REEL View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
AD5370BSTZ-REEL Datasheet PDF : 28 Pages
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AD5370
OUTLINE DIMENSIONS
9.00
BSC SQ
PIN 1
INDICATOR
TOP VIEW
0.60
MAX
0.60 MAX
49
48
64 1
PIN 1
INDICATOR
8.75
BSC SQ
0.50
BSC
EXPOSED PAD
(BOTTOM VIEW)
7.25
7.10 SQ
6.95
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
33
32
16
17
0.30
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
7.50
REF
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
Figure 25. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-3)
Dimensions shown in millimeters
0.25 MIN
0.75
0.60
0.45
1.60
MAX
12.20
12.00 SQ
11.80
64
1
PIN 1
49
48
1.45
1.40
1.35
0.15
0.05
SE ATING
PLANE
0.20
0.09
7°
3.5°
0°
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
10.20
10.00 SQ
9.80
16
17
VIEW A
0.50
BSC
LEAD PITCH
33
32
0.27
0.22
0.17
ORDERING GUIDE
Model
AD5370BCPZ1
AD5370BCPZ-REEL71
AD5370BSTZ1
AD5370BSTZ-REEL1
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
Figure 26. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
64-Lead Low Profile Quad Flat Package (LQFP)
64-Lead Low Profile Quad Flat Package (LQFP)
1 Z = RoHS Compliant Part.
Package Option
CP-64-3
CP-64-3
ST-64-2
ST-64-2
Rev. 0 | Page 27 of 28
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