ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter
VDD to GND
SCL, SDA to GND
A0 to GND
Reference Input Voltage to GND
VOUTA−VOUTB to GND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature (TJ max)
MSOP Package
Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +105°C
−65°C to +150°C
150°C
(TJ max − TA)θJA
206°C/W
44°C/W
220 +5/−0°C
10 s to 40 s
AD5337/AD5338/AD5339
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Transient currents of up to 100 mA do not cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 7 of 24