EVAL-ADG902EB(RevA) View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
EVAL-ADG902EB
(Rev.:RevA)
(Rev.:RevA)
Analog Devices
EVAL-ADG902EB Datasheet PDF : 12 Pages
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ADG901/ADG902
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4 V
Inputs to GND . . . . . . . . . . . . . . . . . . –0.5 V to VDD + 0.3 V2
Continuous Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 dBm
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
MSOP Package
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
LFCSP Package
JA Thermal Impedance (2-layer board) . . . . . . . . . . 84°C/W
JA Thermal Impedance (4-layer board) . . . . . . . . . . 48°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2 RF1/2 Off Port Inputs to Ground ................................... –0.5 V to VDD – 0.5 V
Model
Temperature Range
ADG901BRM
ADG901BRM-500RL7
ADG901BRM-REEL7
ADG901BCP-500RL7
ADG901BCP-REEL7
ADG902BRM
ADG902BRM-500RL7
ADG902BRM-REEL7
ADG902BCP-500RL7
ADG902BCP-REEL7
EVAL-ADG901EB
EVAL-ADG902EB
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
Package Description
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Mini Small Outline Package (MSOP)
Mini Small Outline Package (MSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Evaluation Board
Package Option
RM-8
RM-8
RM-8
CP-8
CP-8
RM-8
RM-8
RM-8
CP-8
CP-8
Branding
W6B
W6B
W6B
W6B
W6B
W7B
W7B
W7B
W7B
W7B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG901/ADG902 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
8-Lead MSOP (RM-8)
8-Lead 3 mm ؋ 3 mm LFCSP (CP-8)
VDD 1
CTRL 2
ADG901/
ADG902
8 RF2
7 GND
GND 3 TOP VIEW 6 GND
RF1 4 (Not to Scale) 5 GND
Table I. Truth Table
CTRL
0
1
Signal Path
RF1 isolated from RF2
RF1 to RF2
REV. A
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Function
1
VDD
2
CTRL
3, 5, 6, 7 GND
4
RF1
8
RF2
Power Supply Input. These parts can
be operated from 1.65 V to 2.75 V;
VDD should be decoupled to GND.
CMOS or TTL Logic Level.
0 ➞ RF1 Isolated from RF2
1 ➞ RF1 to RF2
Ground Reference Point for All
Circuitry on the Part.
RF1 Port.
RF2 Port.
–3–
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