ADP151CPZ-REDYKIT(RevD) View Datasheet(PDF) - Analog Devices
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ADP151CPZ-REDYKIT Datasheet PDF : 24 Pages
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In the case where the board temperature is known, use the
thermal characterization parameter, ΨJB, to estimate the
junction temperature rise (see Figure 57 and Figure 58).
Maximum junction temperature (TJ) is calculated from the
board temperature (TB) and power dissipation (PD) using the
following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package,
43°C/W for the 5-lead TSOT package, and 28.3°C/W for the 6-lead
LFCSP package.
140
MAXIMUM JUNCTION TEMPERATURE
120
100
80
60
40
20
ILOAD = 1mA
ILOAD = 100mA
ILOAD = 10mA
ILOAD = 150mA
ILOAD = 50mA
ILOAD = 200mA
0
0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8
VIN – VOUT (V)
Figure 57. WLCSP, TA = 85°C
ADP151
140
MAXIMUM JUNCTION TEMPERATURE
120
100
80
60
40
20
ILOAD = 1mA
ILOAD = 100mA
ILOAD = 10mA
ILOAD = 150mA
ILOAD = 50mA
ILOAD = 200mA
0
0.3 0.8 1.3 1.8 2.3 2.8 3.3 3.8 4.3 4.8
VIN – VOUT (V)
Figure 58. TSOT, TA = 85°C
140
MAXIMUM JUNCTION TEMPERATURE
120
100
80
60
40
20
ILOAD = 1mA
ILOAD = 100mA
ILOAD = 10mA
ILOAD = 150mA
ILOAD = 50mA
ILOAD = 200mA
0
0.3
1.3
2.3
3.3
4.3
5.3
VIN – VOUT (V)
Figure 59. LFCSP, TA = 85°C
Rev. D | Page 19 of 24
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