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ADS6445, ADS6444
ADS6443, ADS6442
SLAS531 – MAY 2007
TIMING SPECIFICATIONS(1)
Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD =
LVDD = 3.3 V, maximum rated sampling frequency, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF (2), IO = 3.5
mA, RL = 100 Ω(3), no internal termination, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
tJ
Aperture jitter
All
Uncertainty in the sampling instant
INTERFACE: 2-wire, DDR bit clock, 14x serialization
250
fs rms
ADS6445
0.35 0.55
tsu
Data setup time(4)(5)(6)
ADS6444
From data cross-over to bit clock cross-over
ADS6443
0.45 0.65
ns
0.65 0.85
ADS6442
0.8 1.1
ADS6445
0.35 0.58
th
Data hold time(4)(5)(6)
ADS6444
From bit clock cross-over to data cross-over
ADS6443
0.5 0.7
ns
0.7 0.9
ADS6442
0.8 1.1
tpd_clk Clock propagation delay (6)
All
Input clock rising edge cross-over to frame clock rising edge
cross-over
3.4 4.4 5.4 ns
Bit clock cycle-cycle jitter (5)
All
350
ps pp
Frame clock cycle-cycle jitter (5) All
75
ps pp
Below specifications apply for 5 MSPS ≤ Fs ≤ 125 MSPS and all interface options.
tA
Aperture delay
Aperture delay variation
All
Delay from input clock rising edge to the actual sampling instant
1
2
3 ns
All
Channel-channel within same device
–250 ±80 250 ps
ADC Latency (7)
All
Time for a sample to propagate to ADC outputs, see Figure 1
12
Clock
cycles
Time to valid data after coming out of global power down
100 µs
Wake up time
All
Time to valid data after input clock is re-started
Time to valid data after coming out of channel standby
100 µs
200
Clock
cycles
tRISE Data rise time
All
tFALL Data fall time
All
tRISE
Bit clock and frame clock rise
time
All
From –100 mV to +100 mV
From +100 mV to –100 mV
From –100mV to +100mV
50 100 200 ps
50 100 200 ps
50 100 200 ps
tFALL
Bit clock and frame clock fall
time
All
From +100mV to –100mV
50 100 200 ps
LVDS Bit clock duty cycle
All
45% 50% 55%
LVDS Frame clock duty cycle
All
47% 50% 53%
(1) Timing parameters are ensured by design and characterization and not tested in production.
(2) CL is the external single-ended load capacitance between each output pin and ground.
(3) Io refers to the LVDS buffer current setting; RL is the external differential load resistance between the LVDS output pair.
(4) Timing parameters are measured at the end of a 2 inch pcb trace (100-Ω characteristic impedance) terminated by RLand CL.
(5) Setup and hold time specifications take into account the effect of jitter on the output data and clock.
(6) Refer to Output Timings in application section for timings at lower sampling frequencies and other interface options.
(7) Note that the total latency = ADC latency + internal serializer latency. The serializer latency depends on the interface option selected as
shown in Table 27.
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