ADSP-BF516KSWZ-3(RevD) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADSP-BF516KSWZ-3
(Rev.:RevD)

Blackfin Embedded Processor

Analog Devices 

ADSP-BF512/BF514/BF514F16/BF516/BF518/BF518F16

OUTLINE DIMENSIONS

Dimensions in Figure 73 are shown in millimeters.

0.75

0.60

0.45

1.00 REF

1.60

MAX

176

1

26.20

26.00 SQ

25.80

PIN 1

24.10

24.00 SQ

23.90

NOTE: THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND

THERMALLY CONNECTED TO GND. IMPLEMENT THIS BY

SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS

THE SAME SIZE AS THE EXPOSED PAD. THE GND PCB LAND

SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN

THE PCB WITH AN ARRAY OF THERMAL VIAS FOR BEST

PERFORMANCE.

133

133

176

132

132

1

1.45

1.40

1.35

0.15

0.10

0.05

12°

SEATING

PLANE

0.20

0.15

0.09

7°

0°

0.08 MAX

COPLANARITY

VIEW A

ROTATED 90° CCW

TOP VIEW

(PINS DOWN)

44

45

VIEW A

0.50

BSC

LEAD PITCH

89

88

89

88

0.27

0.22

0.17

COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD

Figure 73. 176-Lead Low Profile Quad Flat Package [LQFP_EP]

(SQ-176-2)

Dimensions shown in millimeters

EXPOSED

PAD

5.80 REF

SQ

BOTTOM VIEW

(PINS UP)

44

45

EXPOSED PAD IS CENTERED ON

THE PACKAGE.

Rev. D | Page 65 of 68 | April 2014

Share Link: