ADSP-BF516KSWZ-3(RevD) View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADSP-BF516KSWZ-3
(Rev.:RevD)

Blackfin Embedded Processor

Analog Devices 

ADSP-BF512/BF514/BF514F16/BF516/BF518/BF518F16

A1 BALL

CORNER

12.10

12.00 SQ

11.90

TOP VIEW

1.50

DETAIL A

1.40

1.30

10.40

BSC SQ

0.80

BSC

0.80

REF

14 13 12 11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

BOTTOM VIEW

A1 BALL

CORNER

0.70

REF

0.36

REF

SEATING

PLANE

DETAIL A

1.12

1.06

1.00

0.34 NOM

0.29 MIN

0.50

COPLANARITY

0.45

0.20

0.40

BALL DIAMETER

COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.

Figure 74. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-168-1)

Dimensions shown in millimeters

SURFACE-MOUNT DESIGN

Table 56 is provided as an aid to PCB design. For industry

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Table 56. BGA Data for Use with Surface-Mount Design

Package

168-Ball CSP_BGA

Package Ball Attach Type

Solder Mask Defined

Package Solder Mask

Opening

0.35 mm diameter

Package Ball Pad Size

0.48 mm diameter

Rev. D | Page 66 of 68 | April 2014

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