ESDALC6V1-1M2(2007) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
ESDALC6V1-1M2 Datasheet PDF : 10 Pages
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ESDALC6V1-1M2
3
Package information
Package information
Note:
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Table 3. SOD882 dimensions
D
INDEX AREA
(D/2 xE/2)
TOP VIEW
INDEX AREA
(D/2 xE/2)
SIDE VIEW
b1
b2
OPTIONAL PIN#1 ID
e
BOTTOM VIEW
Dimensions
Ref Millimetres
Inches
Min Typ Max Min Typ Max
A 0.40 0.47 0.50 0.016 0.019 0.020
A1 0.00
0.05 0.000
0.002
b1 0.20 0.25 0.30 0.008 0.010 0.012
b2 0.20 0.25 0.30 0.008 0.010 0.012
D
1.00
0.039
E
0.60
0.024
e
0.65
0.026
L1 0.45 0.50 0.55 0.018 0.020 0.022
L2 0.45 0.50 0.55 0.018 0.020 0.022
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
Figure 12. Footprint (dimensions in mm) Figure 13. Marking
0.55
0.55
0.50
0.40
Pin1
N
PPinin2 2
5/10
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