ML2264
PIN DESCRIPTION
PIN# NAME
1 A IN 4
2 A IN 3
3 A IN 2
4 A IN 1
5 MODE
6 DB0
7 DB1
8 DB2
8 DB3
10 RD
11 INT
12 GND
13 –VREF
14 +VREF
FUNCTION
Analog input 4.
Analog input 3.
Analog input 2.
Analog input 1.
Mode select input.
MODE = GND: RD mode
MODE = VCC: WR-RD mode
Pin has internal current source
pulldown to GND.
Data output — bit 0 (LSB).
Data output — bit 1.
Data output — bit 2.
Data output — bit 3.
Read input. In RD mode, this pin
initiates a conversion. In WR-RD
mode, this pin latches data into output
latches. See Digital Interface section.
Interrupt output. This output signals
the end of a conversion and indicates
that data is valid on the data outputs.
See Digital Interface section.
Ground.
Negative reference voltage for
A/D converter.
Positive reference voltage for
A/D converter.
PIN# NAME
15 WR/RDY
16 CS
17 DB4
18 DB5
19 DB6
20 DB7
21 A1
22 A0
23 SH/TH
24 VCC
FUNCTION
Write input or ready output. In WR-RD
mode, this pin is WR input. In RD
mode, this pin is RDY open drain
output. See Digital Interface section.
Chip select input. This pin must be
held low for the device to perform a
conversion.
Data output — bit 4.
Data output — bit 5.
Data output — bit 6.
Data output — bit 7 (MSB).
Digital address input 1 that selects
analog input channel. See multiplexer
addressing section.
Digital address input 0 that selects
analog input channel. See multiplexer
addressing section.
S/H, T/H mode select. When SH/TH =
VCC, the device is in sample and hold
mode. When SH/TH = GND, the
device is in track and hold mode. Pin
has internal pulldown current source
to GND.
Positive supply. +5 volts ± 5%.
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings are those values beyond which
the device could be permanently damaged. Absolute
maximum ratings are stress ratings only and functional
device operation is not implied.
Supply Voltage, VCC ................................................. 6.5V
Voltage
Logic Inputs ................................. –0.3V to VCC + 0.3V
Analog Inputs .............................. –0.3V to VCC + 0.3V
Input Current per Pin (Note 2) .............................. ±25mA
Storage Temperature .............................. –65°C to +150°C
Package Dissipation
at TA = 25°C (Board Mount) ............................. 875mW
Lead Temperature (Soldering 10 sec.)
Dual-In-Line Package (Plastic) ............................ 260°C
Dual-In-Line Package (Ceramic) ......................... 300°C
SOIC
Vapor Phase (60 sec.) ..................................... 215°C
Infrared (15 sec.) ............................................ 220°C
OPERATING CONDITIONS
Supply Voltage, VCC ............................ 4.5VDC to 6.0VDC
Temperature Range (Note 3) ................. TMIN - TA - TMAX
ML2264CCS
ML2264CCP
ML2264CCR ........................................... 0°C to +70°C
2