NXP Semiconductors
LPC2364/65/66/67/68
Single-chip 16-bit/32-bit microcontrollers
11. Dynamic characteristics
Table 9. Dynamic characteristics
Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified; VDD(3V3)
over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2] Max
Unit
ARM processor clock frequency
foper
operating frequency
CCLK; 40 C to +85 C
1
CCLK; > 85 C
[3] 1
-
72
MHz
-
60
MHz
IRC; 40 C to +85 C
3.96
4
4.04
MHz
IRC; > 85 C
[3] 3.98
4.02
4.06
MHz
External clock
fosc
oscillator frequency
Tcy(clk)
clock cycle time
tCHCX
clock HIGH time
tCLCX
clock LOW time
tCLCH
clock rise time
tCHCL
clock fall time
I2C-bus pins (P0[27] and P0[28])
1
-
40
-
Tcy(clk) 0.4
-
Tcy(clk) 0.4
-
-
-
-
-
25
1000
-
-
5
5
MHz
ns
ns
ns
ns
ns
tf(o)
output fall time
SSP interface
VIH to VIL
20 + 0.1 Cb[4] -
-
ns
tsu(SPI_MISO) SPI_MISO set-up time
Tamb = 25 C; measured
-
in SPI Master mode; see
Figure 15
11
-
ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[3] LPC2364HBD only.
[4] Bus capacitance Cb in pF, from 10 pF to 400 pF.
tCHCL
tCLCX
tCHCX
tCLCH
Tcy(clk)
Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
002aaa907
LPC2364_65_66_67_68
Product data sheet
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Rev. 7.1 — 16 October 2013
© NXP B.V. 2013. All rights reserved.
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