LTC2209IUP(RevA) View Datasheet(PDF) - Linear Technology
Part Name
Description
Manufacturer
LTC2209IUP Datasheet PDF : 32 Pages
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LTC2209
APPLICATIONS INFORMATION
Grounding and Bypassing
The LTC2209 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2209 has been optimized for a flowthrough layout so
that the interaction between inputs and digital outputs is
minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated
as much as possible. In particular, care should be taken
not to run any digital track alongside an analog signal
track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2209 differential inputs should run parallel and
close to each other. The input traces should be as short
as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2209 is transferred
from the die through the bottom-side exposed pad. For
good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of sufficient area
with as many vias as possible.
2209fa
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