M41ST85W
4
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 8. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG Storage Temperature (VCC Off, Oscillator Off)
SNAPHAT®
SOIC
–40 to 85
°C
–55 to 150
°C
Lead-free lead finish(1)
260
°C
TSLD Lead Solder Temperature for 10 seconds
Standard (SnPb)
lead finish(2)
240
°C
VIO
Input or Output Voltage
VCC
Supply Voltage
IO
Output Current
PD
Power Dissipation
–0.3 to
VCC+0.3
V
–0.3 to 4.6
V
20
mA
1
W
1. For SOH28 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to
exceed 245°C for greater than 30 seconds).
2. The SOX28 package has Lead-free (Pb-free) lead finish, but cannot be exposed to peak reflow temperature in excess of
240°C (use same reflow profile as standard (SnPb) lead finish).
Caution: Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Caution: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
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