MCP4162T-502I/SL View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
MCP4162T-502I/SL Datasheet PDF : 88 Pages
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MCP413X/415X/423X/425X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follows.
TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP413X/415X/423X/425X
Pin
Single
Dual
Rheo Pot (1) Rheo
Pot
8L 8L 10L 14L 16L
Symbol
Weak
I/O
Buffer
Type
Pull-up/
down (2)
Standard Function
1
1
1
1
16 CS
I HV w/ST “smart” SPI Chip Select Input
2
2
2
2
1 SCK
I HV w/ST “smart” SPI Clock Input
3
—
3
3
2 SDI
I HV w/ST “smart” SPI Serial Data Input
—
3
— — — SDI/SDO
I/O HV w/ST “smart” SPI Serial Data Input/Output
(Note 1, Note 3)
4
4
4
——
5
4
3, 4 VSS
5
5 P1B
—
P
A Analog
— Ground
No Potentiometer 1 Terminal B
——
6
6
6 P1W
A Analog
No Potentiometer 1 Wiper Terminal
———
7
7 P1A
A Analog
No Potentiometer 1 Terminal A
—
5
—
8
8 P0A
A Analog
No Potentiometer 0 Terminal A
5
6
7
9
9 P0W
A Analog
No Potentiometer 0 Wiper Terminal
6
7
8
10 10 P0B
A Analog
No Potentiometer 0 Terminal B
— — — 12 13 SHDN
I HV w/ST “smart” Hardware Shutdown
7
—
9
13 14 SDO
O
O
No SPI Serial Data Out
8
8
10 14
15 VDD
— — — 11 11,12 NC
—
P
—
—
— Positive Power Supply Input
— No Connection
9
9
11
—
17 EP
—
—
— Exposed Pad (Note 4)
Legend:
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
I = digital input (high Z)
O = digital output
I/O = Input / Output
P = Power
Note 1:
2:
3:
4:
The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and
shutdown current.
The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s VSS pin.
© 2008 Microchip Technology Inc.
DS22060B-page 31
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