PIC16LC621T-04E/SS View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC621T-04E/SS

EPROM-Based 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16C62X

12.5 DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial)

PIC16CR620A-40(7) (Commercial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature 0°C ≤ TA ≤ +70°C for commercial

Param

No.

Sym

Characteristic

Min Typ† Max Units

Conditions

D001 VDD

D002 VDR

Supply Voltage

RAM Data Retention Voltage(1)

3.0 — 5.5

— 1.5* —

V FOSC = DC to 20 MHz

V Device in SLEEP mode

D003 VPOR

VDD start voltage to ensure

Power-on Reset

— VSS — V See section on Power-on Reset for details

D004 SVDD

VDD rise rate to ensure Power-on

Reset

0.05 —

*

— V/ms See section on Power-on Reset for details

D005 VBOR

D010 IDD

Brown-out Detect Voltage

Supply Current(2,4)

D020 IPD

Power Down Current(3)

D022 ∆IWDT

D022A ∆IBOR

D023 ∆ICOMP

D023A ∆IVREF

WDT Current(5)

Brown-out Reset Current(5)

Comparator Current for each

Comparator(5)

VREF Current(5)

3.65 4.0 4.35 V BOREN configuration bit is cleared

— 1.2 2.0 mA FOSC = 4 MHz, VDD = 5.5V, WDT disabled,

XT OSC mode, (Note 4)*

— 0.4 1.2 mA FOSC = 4 MHz, VDD = 3.0V, WDT disabled,

XT OSC mode, (Note 4)

— 1.0 2.0 mA FOSC = 10 MHz, VDD = 3.0V, WDT disabled,

HS OSC mode, (Note 6)

— 4.0 6.0 mA FOSC = 20 MHz, VDD = 4.5V, WDT disabled,

HS OSC mode

— 4.0 7.0 mA FOSC = 20 MHz, VDD = 5.5V, WDT disabled*,

HS OSC mode

— 35 70 µA FOSC = 32 kHz, VDD = 3.0V, WDT disabled,

LP OSC mode

— — 2.2 µA VDD = 3.0V

— — 5.0 µA VDD = 4.5V*

— — 9.0 µA VDD = 5.5V

— — 15 µA VDD = 5.5V Extended

— 6.0 10 µA VDD = 4.0V

12 µA (125°C)

— 75 125 µA BOD enabled, VDD = 5.0V

— 30 60 µA VDD = 4.0V

— 80 135 µA VDD = 4.0V

∆IEE Write Operating Current

∆IEE Read Operating Current

∆IEE

Standby Current

∆IEE

Standby Current

—

3 mA VCC = 5.5V, SCL = 400 kHz

—

1 mA

—

30 µA VCC = 3.0V, EE VDD = VCC

—

100 µA VCC = 3.0V, EE VDD = VCC

1A

FOSC

LP Oscillator Operating Frequency 0

RC Oscillator Operating Frequency 0

XT Oscillator Operating Frequency 0

HS Oscillator Operating Frequency 0

— 200 kHz All temperatures

— 4 MHz All temperatures

— 4 MHz All temperatures

— 20 MHz All temperatures

* These parameters are characterized but not tested.

† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are

not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate,

oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.

The test conditions for all IDD measurements in Active Operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP

mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/

2REXT (mA) with REXT in kΩ.

5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD

measurement.

6: Commercial temperature range only.

7: See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified

characteristics.

 2003 Microchip Technology Inc.

DS30235J-page 99

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