PIC16LC621T-04E/SS View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16LC621T-04E/SS

EPROM-Based 8-Bit CMOS Microcontrollers

Microchip Technology 

PIC16C62X

12.1 DC Characteristics: PIC16C62X-04 (Commercial, Industrial, Extended)

PIC16C62X-20 (Commercial, Industrial, Extended)

PIC16LC62X-04 (Commercial, Industrial, Extended) (CONT.)

PIC16C62X

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

-40°C ≤ TA ≤ +125°C for extended

PIC16LC62X

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for industrial and

0°C ≤ TA ≤ +70°C for commercial and

-40°C ≤ TA ≤ +125°C for extended

Operating voltage VDD range is the PIC16C62X range.

Param Sym

. No.

D022 ∆IWDT

Characteristic

WDT Current(5)

D022A

D023

D023A

D022

D022A

D023

D023A

∆IBOR

∆ICOM

P

∆IVREF

∆IWDT

∆IBOR

∆ICOM

P

∆IVREF

Brown-out Reset Current(5)

Comparator Current for each

Comparator(5)

VREF Current(5)

WDT Current(5)

Brown-out Reset Current(5)

Comparator Current for each

Comparator(5)

VREF Current(5)

Min Typ† Max Units

Conditions

— 6.0 20 µA VDD=4.0V

25 µA (125°C)

— 350 425 µA BOD enabled, VDD = 5.0V

— — 100 µA VDD = 4.0V

— — 300 µA VDD = 4.0V

— 6.0 15 µA VDD=3.0V

— 350 425 µA BOD enabled, VDD = 5.0V

— — 100 µA VDD = 3.0V

— — 300 µA VDD = 3.0V

1A

FOSC LP Oscillator Operating Frequency 0 — 200 kHz All temperatures

RC Oscillator Operating Frequency 0

—

4 MHz All temperatures

XT Oscillator Operating Frequency 0

HS Oscillator Operating Frequency 0

—

4 MHz All temperatures

— 20 MHz All temperatures

1A

FOSC LP Oscillator Operating Frequency 0

— 200 kHz All temperatures

RC Oscillator Operating Frequency 0 — 4 MHz All temperatures

XT Oscillator Operating Frequency 0 — 4 MHz All temperatures

HS Oscillator Operating Frequency 0 — 20 MHz All temperatures

*

†

Note 1:

2:

3:

4:

5:

These parameters are characterized but not tested.

Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not

tested.

This is the limit to which VDD can be lowered without losing RAM data.

The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and

switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current

consumption.

The test conditions for all IDD measurements in Active Operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,

MCLR = VDD; WDT enabled/disabled as specified.

The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with

the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.

For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the

formula: Ir = VDD/2REXT (mA) with REXT in kΩ.

The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the

base IDD or IPD measurement.

 2003 Microchip Technology Inc.

DS30235J-page 89

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