PIC16LC621T-04E/SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC621T-04E/SS Datasheet PDF : 128 Pages
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PIC16C62X
12.2 DC Characteristics: PIC16C62XA-04 (Commercial, Industrial, Extended)
PIC16C62XA-20 (Commercial, Industrial, Extended)
PIC16LC62XA-04 (Commercial, Industrial, Extended)
PIC16C62XA
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ TA ≤ +70°C for commercial and
-40°C ≤ TA ≤ +125°C for extended
PIC16LC62XA
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ TA ≤ +70°C for commercial and
-40°C ≤ TA ≤ +125°C for extended
Param. Sym
No.
Characteristic
Min Typ† Max Units
Conditions
D001 VDD Supply Voltage
3.0 — 5.5 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5
D001 VDD Supply Voltage
2.5 — 5.5 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5
D002
VDR RAM Data Retention
Voltage(1)
— 1.5* —
V Device in SLEEP mode
D002 VDR RAM Data Retention Voltage(1) — 1.5* —
V Device in SLEEP mode
D003
VPOR VDD start voltage to
ensure Power-on Reset
— VSS —
V See section on Power-on Reset for details
D003
VPOR VDD start voltage to
ensure Power-on Reset
— VSS —
V See section on Power-on Reset for details
D004
SVDD VDD rise rate to ensure
Power-on Reset
0.05* — — V/ms See section on Power-on Reset for details
D004
SVDD VDD rise rate to ensure
Power-on Reset
0.05* — — V/ms See section on Power-on Reset for details
D005
D005
VBOR Brown-out Detect Voltage
VBOR Brown-out Detect Voltage
3.7 4.0 4.35
3.7 4.0 4.35
V BOREN configuration bit is cleared
V BOREN configuration bit is cleared
*
†
Note 1:
2:
3:
4:
5:
6:
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
This is the limit to which VDD can be lowered without losing RAM data.
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all IDD measurements in Active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the
formula: Ir = VDD/2REXT (mA) with REXT in kΩ.
The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
base IDD or IPD measurement.
Commercial temperature range only.
DS30235J-page 90
2003 Microchip Technology Inc.
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