PIC16LC621A-04/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC621A-04/SO Datasheet PDF : 128 Pages
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PIC16C62X
12.5 DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial)
PIC16CR620A-40(7) (Commercial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0°C ≤ TA ≤ +70°C for commercial
Param
No.
Sym
Characteristic
Min
Typ†
Max
Unit
Conditions
VIL
Input Low Voltage
I/O ports
D030
with TTL buffer
VSS
—
0.8V
V VDD = 4.5V to 5.5V, otherwise
0.15VDD
D031
with Schmitt Trigger input
VSS
0.2VDD
V
D032
MCLR, RA4/T0CKI, OSC1
VSS
—
0.2VDD
V (Note 1)
(in RC mode)
D033
OSC1 (in XT and HS)
VSS
—
0.3VDD
V
OSC1 (in LP)
VSS
— 0.6VDD - 1.0 V
VIH
Input High Voltage
I/O ports
D040
with TTL buffer
2.0V
—
VDD
V VDD = 4.5V to 5.5V, otherwise
0.25 VDD + 0.8
VDD
D041
with Schmitt Trigger input
0.8 VDD
VDD
D042
MCLR RA4/T0CKI
0.8 VDD
—
VDD
V
D043
D043A
OSC1 (XT, HS and LP)
OSC1 (in RC mode)
0.7 VDD
—
VDD
V
0.9 VDD
(Note 1)
D070 IPURB
IIL
PORTB Weak Pull-up Current
Input Leakage Current(2, 3)
I/O ports (except PORTA)
50
200
400
µA VDD = 5.0V, VPIN = VSS
±1.0
µA VSS ≤ VPIN ≤ VDD, pin at hi-impedance
D060
PORTA
—
—
±0.5
µA Vss ≤ VPIN ≤ VDD, pin at hi-impedance
D061
RA4/T0CKI
—
—
±1.0
µA Vss ≤ VPIN ≤ VDD
D063
OSC1, MCLR
—
—
±5.0
µA Vss ≤ VPIN ≤ VDD, XT, HS and LP OSC con-
figuration
VOL Output Low Voltage
D080
I/O ports
—
—
0.6
V IOL = 8.5 mA, VDD = 4.5V, -40° to +85°C
—
—
0.6
V IOL = 7.0 mA, VDD = 4.5V, +125°C
D083
OSC2/CLKOUT (RC only)
—
—
0.6
V IOL = 1.6 mA, VDD = 4.5V, -40° to +85°C
VOH
Output High Voltage(3)
—
—
0.6
V IOL = 1.2 mA, VDD = 4.5V, +125°C
D090
I/O ports (except RA4)
VDD-0.7
—
—
V IOH = -3.0 mA, VDD = 4.5V, -40° to +85°C
VDD-0.7
—
—
V IOH = -2.5 mA, VDD = 4.5V, +125°C
D092
OSC2/CLKOUT (RC only)
VDD-0.7
—
—
V IOH = -1.3 mA, VDD = 4.5V, -40° to +85°C
VDD-0.7
—
—
V IOH = -1.0 mA, VDD = 4.5V, +125°C
*D150 VOD Open Drain High Voltage
8.5
V RA4 pin
Capacitive Loading Specs on
Output Pins
D100 COSC2 OSC2 pin
15
pF In XT, HS and LP modes when external
clock used to drive OSC1.
D101 CIO
All I/O pins/OSC2 (in RC mode)
50
pF
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate,
oscillator type, internal code execution pattern, and temperature also have an impact on the current
consumption.
The test conditions for all IDD measurements in Active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP
mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/
2REXT (mA) with REXT in kΩ.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD
measurement.
6: Commercial temperature range only.
7: See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified
characteristics.
DS30235J-page 100
2003 Microchip Technology Inc.
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