PIC10F200/202/204/206
TABLE 12-6: THERMAL CONSIDERATIONS
Standard Operating Conditions (unless otherwise specified)
Param.
No.
Sym.
Characteristic
Typ. Units
Conditions
TH01 JA
Thermal Resistance Junction to
Ambient
60 C/W 6-pin SOT-23 package
80 C/W 8-pin PDIP package
90 C/W 8-pin DFN package
TH02 JC
Thermal Resistance Junction to
Case
31.4 C/W 6-pin SOT-23 package
24 C/W 8-pin PDIP package
24 C/W 8-pin DFN package
TH03 TJMAX
Maximum Junction Temperature
150 C
TH04 PD
Power Dissipation
TH05 PINTERNAL Internal Power Dissipation
—
W PD = PINTERNAL + PI/O
—
W PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
—
W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
—
W PDER = PDMAX (TJ - TA)/JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature; TJ = Junction Temperature.
DS40001239F-page 66
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