PIC16CR67-10 View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16CR67-10 Datasheet PDF : 336 Pages
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PIC16C6X
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
22.2 DC Characteristics: PIC16LCR63/R65-04 (Commercial, Industrial)
DC CHARACTERISTICS
Param
No.
Characteristic
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Sym Min Typ† Max Units
Conditions
D001
D002*
D003
D004*
D005
D010
Supply Voltage
VDD 3.0 - 5.5 V LP, XT, RC osc configuration (DC - 4 MHz)
RAM Data Retention
Voltage (Note 1)
VDR
- 1.5 - V
VDD start voltage to
VPOR - VSS -
ensure internal Power-on
Reset signal
V See section on Power-on Reset for details
VDD rise rate to ensure SVDD 0.05 -
internal Power-on Reset
signal
- V/ms See section on Power-on Reset for details
Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled
Supply Current (Note 2, 5) IDD
- 2.0 3.8 mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
D010A
- 22.5 48 µA LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D015* Brown-out Reset Current ∆IBOR - 350 425 µA BOR enabled, VDD = 5.0V
(Note 6)
D020 Power-down Current
IPD
- 7.5 30 µA VDD = 3.0V, WDT enabled, -40°C to +85°C
D021 (Note 3, 5)
- 0.9 5 µA VDD = 3.0V, WDT disabled, 0°C to +70°C
D021A
- 0.9 5 µA VDD = 3.0V, WDT disabled, -40°C to +85°C
D023* Brown-out Reset Current ∆IBOR - 350 425 µA BOR enabled, VDD = 5.0V
(Note 6)
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
© 1997 Microchip Technology Inc.
Preliminary
DS30234D-page 249
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