PIC16LC773I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.8 K04-076 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.1 mm Lead Form
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
E
# leads = n1
p
D D1
2
1
B
n
X x 45°
L
R2
A
c
R1
L1
A2
A1
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
p
0.031
0.80
Number of Pins
n
44
44
Pins along Width
n1
11
11
Overall Pack. Height
A
0.039
0.043
0.047
1.00
1.10
1.20
Shoulder Height
A1
0.015
0.025
0.035
0.38
0.64
0.89
Standoff
A2
0.002
0.004
0.006
0.05
0.10
0.15
Shoulder Radius
R1
0.003
0.003
0.010
0.08
0.08
0.25
Gull Wing Radius
R2
0.003
0.006
0.008
0.08
0.14
0.20
Foot Length
L
0.005
0.010
0.015
0.13
0.25
0.38
Foot Angle
0
3.5
7
0
3.5
7
Radius Centerline
L1
0.003
0.008
0.013
0.08
0.20
0.33
Lead Thickness
Lower Lead Width
c
0.004
0.006
0.008
0.09
0.15
0.20
B†
0.012
0.015
0.018
0.30
0.38
0.45
Outside Tip Length
D1
0.463
0.472
0.482
11.75
12.00
12.25
Outside Tip Width
E1
Molded Pack. Length
D‡
Molded Pack. Width
E‡
0.463
0.390
0.390
0.472
0.394
0.394
0.482
0.398
0.398
11.75
9.90
9.90
12.00
10.00
10.00
12.25
10.10
10.10
Pin 1 Corner Chamfer
X
0.025
0.035
0.045
0.64
0.89
1.14
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
12
15
5
12
15
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent:MS-026 ACB
1999-2013 Microchip Technology Inc.
Advance Information
DS30275B-page 183
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