PIC16LC773I/SO View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16LC773I/SO Datasheet PDF : 202 Pages
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PIC16C77X
17.10 K04-048 44-Lead Plastic Leaded Chip Carrier (L) – Square
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
E
# leads = n1
D D1
n12
CH2 x 45°
CH1 x 45°
A3
R1
L
A1
35° A
c
R2
E2
B1
B
A2
p
D2
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
44
44
Pitch
p
0.050
1.27
Overall Pack. Height
A
0.165
0.173
0.180
4.19
4.38
4.57
Shoulder Height
A1
0.095
0.103
0.110
2.41
2.60
2.79
Standoff
A2
0.015
0.023
0.030
0.38
0.57
0.76
Side 1 Chamfer Dim.
A3
0.024
0.029
0.034
0.61
0.74
0.86
Corner Chamfer (1)
CH1
0.040
0.045
0.050
1.02
1.14
1.27
Corner Chamfer (other) CH2
0.000
0.005
0.010
0.00
0.13
0.25
Overall Pack. Width
E1
0.685
0.690
0.695
17.40
17.53
17.65
Overall Pack. Length
D1
Molded Pack. Width
E‡
Molded Pack. Length
D‡
0.685
0.650
0.650
0.690
0.653
0.653
0.695
0.656
0.656
17.40
16.51
16.51
17.53
16.59
16.59
17.65
16.66
16.66
Footprint Width
E2
0.610
0.620
0.630
15.49
15.75
16.00
Footprint Length
D2
0.610
0.620
0.630
15.49
15.75
16.00
Pins along Width
n1
11
11
Lead Thickness
c
Upper Lead Width
B1†
0.008
0.010
0.012
0.20
0.25
0.30
0.026
0.029
0.032
0.66
0.74
0.81
Lower Lead Width
B
0.015
0.018
0.021
0.38
0.46
0.53
Upper Lead Length
L
0.050
0.058
0.065
1.27
1.46
1.65
Shoulder Inside Radius R1
0.003
0.005
0.010
0.08
0.13
0.25
J-Bend Inside Radius
R2
0.015
0.025
0.035
0.38
0.64
0.89
Mold Draft Angle Top
0
5
10
0
5
10
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent:MO-047 AC
1999-2013 Microchip Technology Inc.
Advance Information
DS30275B-page 185
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