PIC16F688T-E/ML View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F688T-E/ML

14-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC16F688

14.6 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +125°C

Param

No.

TH01

TH02

TH03

TH04

TH05

TH06

TH07

Note 1:

2:

3:

Sym

Characteristic

Typ

Units

Conditions

θJA

Thermal Resistance

Junction to Ambient

69.8

C/W 14-pin PDIP package

85.0

C/W 14-pin SOIC package

100.4

C/W 14-pin TSSOP package

46.3

C/W 16-pin QFN 4x0.9mm package

θJC

Thermal Resistance

Junction to Case

32.5

C/W 14-pin PDIP package

31.0

C/W 14-pin SOIC package

31.7

C/W 14-pin TSSOP package

2.6

C/W 16-pin QFN 4x0.9mm package

TJ

Junction Temperature

150

C For derated power calculations

PD

Power Dissipation

—

W PD = PINTERNAL + PI/O

PINTERNAL Internal Power Dissipation

—

W PINTERNAL = IDD x VDD

(NOTE 1)

PI/O

I/O Power Dissipation

—

W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

PDER

Derated Power

—

W PDER = (TJ - TA)/θJA

(NOTE 2, 3)

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature.

Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power (PDER).

© 2007 Microchip Technology Inc.

DS41203D-page 151

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