PIC16F688T-I/ST View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F688T-I/ST

14-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC16F688

16.2 Package Details

The following sections give the technical details of the

packages.

14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

E1

123

D

E

A

A2

L

A1

b1

b

e

c

eB

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

14

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.210

Molded Package Thickness

A2

.115

.130

.195

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.290

.310

.325

Molded Package Width

E1

.240

.250

.280

Overall Length

D

.735

.750

.775

Tip to Seating Plane

L

.115

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.045

.060

.070

Lower Lead Width

b

.014

.018

.022

Notes:

Overall Row Spacing §

eB

–

–

.430

1. Pin 1 visual index feature may vary, but must be located with the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-005B

DS41203D-page 186

© 2007 Microchip Technology Inc.

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