PIC16F688T-I/ST View Datasheet(PDF) - Microchip Technology

Part Name

Description

Manufacturer

PIC16F688T-I/ST

14-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology

Microchip Technology 

PIC16F688

14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

NOTE 1

A

123

b

E

E1

e

h

h

α

A2

φ

c

A1

L

L1

β

Units

Dimension Limits

MILLMETERS

MIN

NOM

MAX

Number of Pins

Pitch

Overall Height

N

14

e

1.27 BSC

A

–

–

1.75

Molded Package Thickness

Standoff §

Overall Width

A2

1.25

–

–

A1

0.10

–

0.25

E

6.00 BSC

Molded Package Width

Overall Length

Chamfer (optional)

Foot Length

Footprint

Foot Angle

Lead Thickness

E1

3.90 BSC

D

8.65 BSC

h

0.25

–

0.50

L

0.40

–

1.27

L1

1.04 REF

φ

0°

–

8°

c

0.17

–

0.25

Lead Width

b

0.31

–

0.51

Mold Draft Angle Top

α

5°

–

15°

Notes:

Mold Draft Angle Bottom

β

5°

–

15°

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-065B

© 2007 Microchip Technology Inc.

DS41203D-page 187

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