PIC16F753-I/SLQTP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC16F753-I/SLQTP Datasheet PDF : 238 Pages
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PIC16F753/HV753
22.9 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param.
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
TH02
TH03
TH04
TH05
TH06
TH07
*
Note 1:
2:
JA
Thermal Resistance
Junction to Ambient
84.6*
149.5*
C/W 8-pin PDIP package
C/W 8-pin SOIC package
60*
C/W 8-pin DFN 3x3mm package
JC
Thermal Resistance
Junction to Case
41.2*
39.9*
C/W 8-pin PDIP package
C/W 8-pin SOIC package
9*
C/W 8-pin DFN 3x3mm package
TDIE
Die Temperature
150*
C
PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
—
W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
PDER
Derated Power
—
W PDER = PDMAX (TDIE - TA)/JA
(NOTE 2)
These parameters are characterized but not tested.
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient temperature.
D40001709A-page 198
Preliminary
2013 Microchip Technology Inc.
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