PIC18LF448T-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC18LF448T-I/SP
Microchip Technology
PIC18LF448T-I/SP Datasheet PDF : 402 Pages
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PIC18FXX8
29.2 Package Details
The following sections give the technical details of the packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
D
2
n
1
E
A
c
β
A1
B1
eB
B
α
A2
L
p
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
28
p
.100
28
2.54
Top to Seating Plane
A
.140
.150
.160
3.56
3.81
4.06
Molded Package Thickness
A2
.125
.130
.135
3.18
3.30
3.43
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.310
.325
7.62
7.87
8.26
Molded Package Width
E1
.275
.285
.295
6.99
7.24
7.49
Overall Length
D
1.345
1.365
1.385
34.16
34.67
35.18
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.040
.053
.065
1.02
1.33
1.65
Lower Lead Width
B
.016
.019
.022
0.41
0.48
0.56
Overall Row Spacing
§ eB
.320
.350
.430
8.13
8.89
10.92
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
© 2006 Microchip Technology Inc.
DS41159E-page 379
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