PIC18LF448T-I/SP View Datasheet(PDF) - Microchip Technology
Part Name
Description
Manufacturer
PIC18LF448T-I/SP
Microchip Technology
PIC18LF448T-I/SP Datasheet PDF : 402 Pages
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PIC18FXX8
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
E1
#leads=n1
D1 D
n12
CH2 x 45 °
CH1 x 45 °
A3
α
A2
35° A
c
β
E2
B1
B
A1
p
D2
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
44
p
.050
44
1.27
Pins per Side
n1
11
11
Overall Height
A
.165
.173
.180
4.19
4.39
4.57
Molded Package Thickness
A2
.145
.153
.160
3.68
3.87
4.06
Standoff
§
A1
.020
.028
.035
0.51
0.71
0.89
Side 1 Chamfer Height
A3
.024
.029
.034
0.61
0.74
0.86
Corner Chamfer 1
CH1
.040
.045
.050
1.02
1.14
1.27
Corner Chamfer (others)
CH2
.000
.005
.010
0.00
0.13
0.25
Overall Width
E
.685
.690
.695
17.40
17.53
17.65
Overall Length
D
.685
.690
.695
17.40
17.53
17.65
Molded Package Width
E1
.650
.653
.656
16.51
16.59
16.66
Molded Package Length
D1
.650
.653
.656
16.51
16.59
16.66
Footprint Width
E2
.590
.620
.630
14.99
15.75
16.00
Footprint Length
D2
.590
.620
.630
14.99
15.75
16.00
Lead Thickness
c
.008
.011
.013
0.20
0.27
0.33
Upper Lead Width
B1
.026
.029
.032
0.66
0.74
0.81
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
.013
.020
.021
0.33
0.51
0.53
α
0
5
10
0
5
10
β
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
DS41159E-page 382
© 2006 Microchip Technology Inc.
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