ATSAM4LS4BA-AU View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

ATSAM4LS4BA-AU

ATSAM ARM-based Flash MCU

Atmel Corporation 

Figure 10-8. QFN-64 Package Drawing

ATSAM4L8/L4/L2

Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.

Table 10-23. Device and Package Maximum Weight

200

mg

Table 10-24. Package Characteristics

Moisture Sensitivity Level

MSL3

Table 10-25. Package Reference

JEDEC Drawing Reference

JESD97 Classification

MO-220

E3

42023GS–SAM–03/2014

161

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