ATSAM4LS4BA-AU View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

ATSAM4LS4BA-AU

ATSAM ARM-based Flash MCU

Atmel Corporation 

Figure 10-10. QFN-48 Package Drawing for ATSAM4LC4/2 and ATSAM4LS4/2

ATSAM4L8/L4/L2

Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.

Table 10-29. Device and Package Maximum Weight

140

Table 10-30. Package Characteristics

Moisture Sensitivity Level

Table 10-31. Package Reference

JEDEC Drawing Reference

JESD97 Classification

mg

MSL3

MO-220

E3

42023GS–SAM–03/2014

163

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