Si3232
Pin #(s)
15
16
epad
Symbol Input/ Description
Output
ITIPN
I
Negative TIP Current Control—Connect to the ITIPN lead of the Si3232.
ITIPP
I
Positive TIP Current Control—Connect to the ITIPP lead of the Si3232.
GND
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See "13. Package Outline: 16-Pin
ESOIC" on page 124 for PCB pad dimensions.
Preliminary Rev. 0.96
121