Si3232
12. Package Outline: 64-Pin eTQFP
Figure 39 illustrates the package details for the Si3232. Table 33 lists the values for the dimensions shown in the
illustration.
Figure 39. 64-Pin Thin Quad Flat Package (TQFP)
Table 33. 64-Pin Package Diagram Dimensions
Symbol
Millimeters
Symbol
Millimeters
Min
Nom
Max
Min
Nom
Max
A
—
—
1.20
E
12.00 BSC.
A1
0.05
—
0.15
E1
10.00 BSC.
A2
0.95
1.00
1.05
E2
4.35
4.50
4.65
b
0.17
0.22
0.27
L
0.45
0.60
0.75
c
0.09
—
0.20
aaa
—
—
0.20
D
12.00 BSC.
bbb
—
—
0.20
D1
10.00 BSC.
ccc
—
—
0.08
D2
4.35
4.50
4.65
ddd
—
—
0.08
e
0.50 BSC.
Θ
0°
3.5°
7°
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1982.
3. This package outline conforms to JEDEC MS-026, variant ACD-HD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020B specification for Small Body
Components.
Preliminary Rev. 0.96
123