Si3233
8. Package Outline: 38-Pin QFN
Figure 19 illustrates the package details for the Si3233. Table 39 lists the values for the dimensions shown in the
illustration.
Figure 19. 38-Pin Quad Flat No-Lead Package (QFN)
Table 39. Package Diagram Dimensions1,2,3
Millimeters
Symbol
Min
Nom
Max
A
0.75
0.85
0.95
A1
0.00
0.01
0.05
b
0.18
0.23
0.30
D
5.00 BSC
D2
3.10
3.20
3.30
e
0.50 BSC
E
7.00 BSC
E2
5.10
5.20
5.30
L
0.35
0.45
0.55
L1
0.03
0.05
0.08
aaa
—
—
0.10
bbb
—
—
0.10
ccc
—
—
0.08
ddd
—
—
0.10
Notes:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. The drawing conforms to the JEDEC Solid State Outline
MO-220, Variation VHKD-1.
3. Recommended card reflow profile is per the JEDEC/IPC
J-STD-020C specification for Small Body Components.
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