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ST72334J4B7(2003) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
ST72334J4B7 Datasheet PDF : 153 Pages
First Prev 141 142 143 144 145 146 147 148 149 150 Next Last
ST72334J/N, ST72314J/N, ST72124J
17.2 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in Figure 105 and Figure 106.
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
s Heraeus: PD945, PD955
s Loctite: 3615, 3298
FiguTreem1p0. [5°.CR] e221150505c00000omm00000000000000000000PPe00000000000000000000nHR0000000000dAE00000000000000000000eSH0000000000dE0000000000E0000000000A0000000000W0000000000T00000000008Ia0000000000N00000000000v0000000000eC00000000000000000000S00000000000000000000o0000000000l0000000000d00000000000000000000e0000000000r0000000000i0000000000n0000000000SP0000000000g50000000000OH0000000000PsA0000000000Le0000000000rDS0000000000ocEE0000000000f0000000000Ri0000000000l0000000000eIN00000000000000000000(G0000000000w00000000000000000000it0000000000h0000000000000000000030000000000000000000070000000000%000000000000000000000000000000S00000000000000000000C(nR0000000000O0000000000Oa0000000000O0000000000On0000000000Ld0000000000MI0000000000N00000000006TG00000000003E00000000000000000000P%M0000000000H0000000000P0000000000PAE0000000000Sb0000000000R0000000000E)A00000000000000000000T0000000000U00000000000000000000R00000000000000000000E0000000000)00000000000000000000
0
Time [sec]
20
40
60
80
100
120
140
160
Figure 106. Recommended Reflow Soldering Oven Profile (MID JEDEC)
250
200
150
Temp. [°C]
100
50
90 sec at 125°C
ramp up
2°C/sec for 50sec
Tmax=220+/-5°C
for 25 sec
150 sec above 183°C
ramp down natural
2°C/sec max
0
Time [sec]
100
200
300
400
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