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STE2001 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
STE2001 Datasheet PDF : 36 Pages
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Figure 15.
STE2001
VLCD
B
A1
A0+B
A0
00h
01h
02h
03h
04h
05h 7Ch 7Dh
PRS=0
7Eh
7Fh
00h
01h
02h
03h
04h
05h 7Ch 7Dh 7Eh
PRS=1
7Fh
VO
D01IN1257
Finally, the VLCD voltage at a given (T) temperature can be calculated as:
VLCD(T) = VLCDo · [1 + (T-To) · TC]
Memory Blanking Procedure
This instruction allows to fill the memory with ”blank” patterns, in order to delete patterns randomly generated
in memory when starting up the device. This instruction substitutes (128X9) single ”write” instructions. It is pos-
sible to program ”Memory Blanking Procedure” only under the following conditions:
- X address = 0
- Y address = 0
- V bit
=0
- PD bit
=0
- MX bit = 0
The end of the procedure will be notified on the BSY_FLG pad going HIGH (while LOW the procedure is run-
ning). Any instruction programmed with BSY_FLG LOW will be ignored that is, no instruction can be pro-
grammed for a period equivalent to 128X9 internal write cycles (128X9X1/fclock). The start of Memory blanking
procedure will be between one and two fclock cycles from the last active edge (E rising edge for the parallel
interface, last SCLK rising edge for the Serial interface, last SCL rising edge for the I2C interface).
Checker Board Procedure
This instruction allows to fill the memory with ”checker-board” pattern. It is mainly intended to developers, who
can now simply obtain complex module test configuration by means of a single instruction. It is possible to pro-
gram ”Checker Board Procedure” only under the following conditions:
- X address = 0
- Y address = 0
- V bit
=0
- PD bit
=0
- MX bit = 0
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