STPS130A(1998) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS130A Datasheet PDF : 6 Pages
| |||
Fig. 3-1: Non repetitive surge peak forward current
versus overload duration (maximum values) (SMB).
STPS130A/U
Fig. 3-2: Non repetitive surge peak forward current
versus overload duration (maximum values) (SMA).
IM(A)
8
7
6
Ta=50°C
5
Ta=75°C
4
3
2
IM
Ta=100°C
1
0
1.0E-3
t
δ=0.5
t(s)
1.0E-2
1.0E-1
1.0E+0
IM(A)
8
7
6
5
4
3
2
IM
1
t
δ=0.5
0
1.0E-3
Ta=50°C
Ta=75°C
1.0E-2
Ta=100°C
t(s)
1.0E-1
1.0E+0
Fig. 4-1: Relative variation of thermal impedan ce
junction to ambient versus pulse duration (epoxy
printed circuit board, S(Cu)=35mm, recommended
pad layout). (SMB)
Zth(j-a)/Rth(j-a)
1.0
0.8
0.6 δ = 0.5
0.4
0.2
δ = 0.2
δ = 0.1
0.0
1.0E-2
1.0E-1
Single pulse tp(s)
1.0E+0 1.0E+1
T
δ=tp/T
1.0E+2
tp
1.0E+3
Fig. 4-2: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, S(Cu)=35mm, recommended
pad layout).(SMA )
Zth(j-a)/Rth(j-a)
1.0
0.8
0.6 δ = 0.5
0.4
0.2
δ = 0.2
δ = 0.1
0.0
1E-2
Single pulse tp(s)
1E-1
1E+0 1E+1
T
δ=tp/T
1E+2
tp
1E+3
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
IR(µA)
5E+3
1E+3
Tj=125°C
1E+2
1E+1
1E+0
1E-1
0
Tj=70°C
Tj=25°C
VR(V)
5
10
15
20
25
30
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
500
200
100
50
F=1MHz
Tj=25°C
20
10
1
2
VR(V)
5
10
20 30
3/6
Share Link: 