STPS130A(1998) View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS130A Datasheet PDF : 6 Pages
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STPS130A/U
Fig. 7: Forward voltage drop versus forward cur-
rent (maximum values).
IFM(A)
10.00
1.00
Tj=75°C
0.10
Tj=125°C
Tj=25°C
VFM(V)
0.01
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness:
35µm).(SMB)
Rth(j-a) (°C/W)
120
100
80
60
40
20
0
0
1
S(Cu) (cm )
2
3
P=1.5W
4
5
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board, copper thickness:
35µm).(SMA)
Rth(j-a) (°C/W)
140
120
100
80
60
40
20
0
0
1
S(Cu) (cm )
2
3
P=1.5W
4
5
4/6
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