STPS130 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS130 Datasheet PDF : 7 Pages
| |||
STPS130
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMB)
IM(A)
8
7
6
5
4
3
2
IM
1
0
1.0E-3
t
δ=0.5
1.0E-2
t(s)
1.0E-1
Ta=50°C
Ta=75°C
Ta=100°C
1.0E+0
IM(A)
8
7
6
5
4
3
2
IM
1
0
1.0E-3
t
δ=0.5
1.0E-2
t(s)
1.0E-1
Ta=50°C
Ta=75°C
Ta=100°C
1.0E+0
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMB)
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
δ = 0.5
0.4
δ = 0.2
0.2
δ = 0.1
Single pulse
0.0
1E-2
1E-1
tp(s)
1E+0
1E+1
T
δ=tp/T
1E+2
tp
1E+3
Zth(j-c)/Rth(j-c)
1.0
0.8
0.6
δ = 0.5
0.4
δ = 0.2
0.2
δ = 0.1
Single pulse
0.0
1.0E-2
1.0E-1
tp(s)
1.0E+0
1.0E+1
T
δ=tp/T
1.0E+2
tp
1.0E+3
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
IR(µA)
5E+3
1E+3
Tj=125°C
1E+2
1E+1
1E+0
1E-1
0
Tj=70°C
Tj=25°C
VR(V)
5
10
15
20
25
30
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
C(pF)
500
200
100
50
F=1MHz
Tj=25°C
20
10
1
2
VR(V)
5
10
20
30
3/7
Share Link: 