STPS130 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS130 Datasheet PDF : 7 Pages
| |||
STPS130
Figure 11: Forward voltage drop versus
forward current (maximum values)
IFM(A)
10.00
1.00
0.10
Tj=75°C
Tj=125°C
Tj=25°C
VFM(V)
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Figure 12: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
Rth(j-a)(°C/W)
120
100
80
60
40
20
0
0
1
S(Cu)(cm²)
2
3
P=1.5W
4
5
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
Rth(j-a)(°C/W)
140
120
100
80
60
40
20
0
0
1
S(Cu)(cm²)
2
3
P=1.5W
4
5
4/7
Share Link: 