STPS160AY View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS160AY Datasheet PDF : 9 Pages
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Characteristics
STPS160-Y
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
Figure 8.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Zth(j-c)/Rth(j-c)
1.0
epoxy printed circuit board, e(Cu) = 35 µm
0.9
recommended pad layout
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3 δ = 0.2
0.2 δ = 0.1
0.1 Single pulse
0.0
1E-2
1E-1
tp(s)
1E+0
T
δ=tp/T
1E+1
tp
1E+2
Zth(j-c)/Rth(j-c)
1.0
0.9
epoxy printed circuit board, e(Cu) = 35 µm
recommended pad layout
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3 δ = 0.2
0.2 δ = 0.1
0.1 Single pulse
0.0
1E-2
1E-1
tp(s)
1E+0
1E+1
T
δ=tp/T
1E+2
tp
1E+3
Figure 9.
Reverse leakage current versus
reverse voltage applied
(typical values)
IR(µA)
1E+3
1E+2
Tj=105°C
Tj=75°C
1E+1
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
200
100
F=1MHz
Tj=25°C
50
1E+0
Tj=25°C
1E-1
0
VR(V)
5 10 15 20 25 30 35 40 45 50 55 60
20
10
1
2
VR(V)
5
10
20
50
100
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values)
ambient versus copper surface
under each lead (SMA)
IFM(A)
1E+1
1E+0
Tj=125°C
Tj=25°C
1E-1
VFM(V)
1E-2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Rth(j-a)(°C/W)
140
120
100
80
60
40
20
0
0
1
Epoxy printed circuit board Fr4
copper thickness: 35 µm
S(Cu)(cm²)
2
3
4
5
4/9
Doc ID 023383 Rev 1
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