Characteristics
STPS15H100C-Y
Figure 7.
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 8.
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 9. Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
100
90
epoxy printed board FR4, Cu: 35µm
80
70
60
50
40
30
20
10
S(cm²)
0
0
2
4
6
8
10 12 14 16 18 20
4/7
Doc ID 17686 Rev 1