STPS1L20MF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS1L20MF Datasheet PDF : 7 Pages
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Characteristics
STPS1L20MF
Figure 7.
Reverse leakage currrent versus
reverse voltage applied
(typical values)
IR(mA)
1.E+02
Tj=150°C
1.E+01
Tj=125°C
1.E+00
1.E-01
Tj=100°C
Tj=75°C
Tj=50°C
Figure 8.
Reverse leakage currrent versus
junction temperature
(typical values)
IR(mA)
1.E+02
VR=20V
1.E+01
1.E+00
1.E-01
1.E-02
1.E-03
0
Tj=25°C
2
4
6
1.E-02
VR(V)
1.E-03
8
10 12 14 16 18 20
0
Tj(°C)
25
50
75
100
125
150
Figure 9.
C(pF)
1000
100
10
1
Junction capacitance versus
reverse voltage applied
(typical values)
Figure 10. Forward voltage drop versus
forward current
VR(V)
10
F=1MHz
VOSC=30mVRMS
Tj=25°C
100
IFM(A)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00 0.05
VFM(V)
0.10 0.15
Tj=85°C
(maximum values)
Tj=85°C
(typical values)
0.20 0.25 0.30 0.35
Tj=25°C
(maximum values)
0.40 0.45 0.50
Figure 11. Thermal resistance junction to ambient versus copper surface under tab
(epoxy printed board FR4, copper thickness = 35 µm, typical values)
Rth(j-a)(°C/W)
250
200
150
100
50
S(mm²)
0
0
20
40
60
80 100 120 140 160 180 200
4/7
Doc ID 12640 Rev 2
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