STPS1L40AY View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS1L40AY Datasheet PDF : 9 Pages
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Characteristics
STPS1L40-Y
Figure 7.
Non repetitive surge peak forward Figure 8.
current versus overload duration
(maximum values, SMB)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA)
7 IM(A)
6
5
4
3
2
IM
1
0
1.E-04
t
δ = 0.5
1.E-03
1.E-02
SMB
Ta = 25 °C
Ta = 75 °C
Ta = 125 °C
1.E-01
1.E+00
Zth(j-a)/Rth(j-a)
1.0
0.9
SMA
Epoxy printed circuit board,
0.8
copper thickness = 35 µm,
0.7 recommended pad layout
0.6
0.5
0.4
0.3
0.2
0.1 Single pulse
0.0
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02
1.E+03
Figure 9.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
1.0 Zth(j-a)/Rth(j-a)
0.9
SMB
0.8
Epoxy printed circuit board,
copper thickness = 35 µm,
0.7
recommended pad layout
0.6
0.5
0.4
0.3
0.2
Single pulse
0.1
0.0
1.E-02
1.E-01
1.E+00
1.E+01
tp(s)
1.E+02
1.E+03
Figure 10. Reverse leakage current versus
reverse voltage applied
(typical values)
1.E+02 IR(mA)
1.E+01
Tj = 150 °C
Tj = 125 °C
1.E+00
Tj = 100 °C
1.E-01
1.E-02
1.E-03
0
Tj = 75 °C
Tj = 50 °C
Tj = 25 °C
VR(V)
5
10
15
20
25
30
35
40
Figure 11. Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
1000
F = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
100
Figure 12. Forward voltage drop versus
forward current
(typical values, high level)
10.00 IFM(A)
1.00
Tj = 125 °C
Tj = 25 °C
0.10
10
VR(V)
0.01
VFM(V)
1
10
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
4/9
Doc ID 18247 Rev 1
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