STPS1L40-Y
Characteristics
Figure 13. Forward voltage drop versus
forward current
(typical values, low level)
3.0 IFM(A)
2.5
2.0
Tj = 125 °C
1.5
Tj = 25 °C
1.0
0.5
0.0
VFM(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
140 Rth(j-a)(°C/W)
Epoxy printed circuit board, FR4
120
copper thickness = 35 µm
SMA
100
80
60
40
20
0
Scu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB)
120 Rth(j-a)(°C/W)
Epoxy printed circuit board, FR4
100
copper thickness = 35 µm
SMB
80
60
40
20
0
Scu(cm²)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Doc ID 18247 Rev 1
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