STPS3L25 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
STPS3L25 Datasheet PDF : 4 Pages
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STPS3L25S
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
IR(mA)
1E+2
1E+1
1E+0
Tj=150°C
Tj=125°C
Tj=100°C
1E-1
1E-2
1E-3
0
Tj=25°C
VR(V)
5
10
15
20
25
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
500
F=1MHz
Tj=25°C
100
10
1
2
VR(V)
5
10
20 30
Fig. 7-1: Forward voltage drop versus forward
current (maximum values, high level).
Fig. 7-2: Forward voltage drop versus forward
current (maximum values, low level).
IFM(A)
50
Typical values
Tj=150°C
10
Tj=125°C
Tj=25°C
Tj=100°C
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
IFM(A)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
0.2
Typical values
Tj=150°C
Tj=125°C
Tj=25°C
Tj=100°C
VFM(V)
0.3
0.4
0.5
0.6
Fig. 8: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness:
Rth(j-a) (°C/W)
100
90
80
70
60
50
40
30
S(Cu) (cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
3/4
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